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U77-A1114-100T SFP Cage Connector 1X1 PRESS FIT EMI Shielded

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U77-A1114-100T SFP Cage Connector 1X1 PRESS FIT EMI Shielded

Name: U77A1114100T SFP Cage Connector 1X1 PRESS FIT EMI Shielded
Brand: LINK-PP
Price: 0.11 USD

Buy cheap U77-A1114-100T SFP Cage Connector 1X1 PRESS FIT EMI Shielded product

Brand Name : LINK-PP

Model Number : U77-A1114-100T

Certification : ISO 9001, ISO 14001, UL, SGS, REACH168

Place of Origin : Guangdong,China

MOQ : 20/100/2kpcs

Price : $0.11-$35

Payment Terms : TT,NET30/60/90 Days

Supply Ability : 350K/Month

Delivery Time : Stock

Packaging Details : Tape and Reel, 20/Tray

Specifications : U77-A1114-100T

Connector Type : SFP

Mounting Type : Through Hole

Contact Plating : Tin

Termination Style : Solder Tail

Light Pipe : Without

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The U77-A1114-100T SFP Cage Connector is designed for high-speed data transmission applications, supporting up to 6Gb/s per channel. This versatile cage is compatible with multiple transceivers, offering a compact and cost-effective solution. It is designed to maximize PCB space utilization and is available in Press-Fit and solder-tail versions.

Electrical Performance
Operating Voltage	30 VDC per contact
Operating Current	0.5 A per contact
Differential Impedance	100Ω ± 10Ω
Mechanical Performance
Durability	250 mating cycles
Mating Force	Maximum of 50 N
Contact Normal Force	100 grams
PCB Thickness Solder-Post and Press-Fit (Cage)	1.45 mm (0.057 inches)
PCB Thickness Belly to Belly (Cage)	3.00 mm (0.118 inches)
Unmating Force (Cage)	Maximum of 11.50 N
Insertion Force to PCB (Cage)	1x1 port cage 500 N
Environmental Performance
Operating Temperature Range	-40°C to +85°C
Storage Temperature Range	-55°C to +85°C
RoHS & Halogen-Free	Compliant
Packaging	tape and reel

U77-A1114-100T Dimension:

U77-A1114-100T SFP Cage Connector 1X1 PRESS FIT EMI Shielded

Target Markets of 1X1 SFP Cage Connector

Cellular Infrastructure
Network Interfaces
Hubs
Servers
Storage Solutions
Test and Measurement Equipment

U77-A1114-100T Materials (RoHS Compliant)

Cage: Made from copper alloy
Plating Option 1: 2.54 μm minimum bright tin plating over 1.27 μm minimum nickel underplating (with a solder temperature of up to 230°C)
Plating Option 2: 2.54 μm minimum matte tin plating over 1.27 μm minimum nickel underplating (with a solder temperature of up to 245°C for 10 seconds peak time)
Dust Cover: Thermoplastic, black color
Housing Material: Copper
Contact Plating: Tin

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